信步科技——国内领先的物联网智能硬件平台-云顶国际yd

sv4-q1752

intel 6/7代core i3/i5/i7处理器, q170芯片, 5*pcie, 2*pci, 6*com, 13*usb, 2*lan

支持intel 6/7代core i3/i5/i7处理器
采用intel q170芯片组
6*com, 13*usb, 2*intel千兆网口
1*vga, 1*hdmi, 1*dvi, 1*edp, 支持三屏异显
1*pcie x16, 3*pcie x4, 1*pcie x1, 2*pci
2*mini-pcie支持msata和wifi/3g/4g
支持vpro, amt, raid, tpm 2.0
规格
general
cpu
intel®  6th and 7th generation coretm i3/i5/i7, pentium®, celeron® cpu, lga1151
chipset
intel® q170 chipset, tdp 6w
memory
ddr4-1866/2133, 4*u-dimm, up to 64 gb 
storage
3*sata 3.0, 1*sata 3.0/msata
expansion interface

1*pcie x16, 3*pcie x4,

1*pcie x1 or mini-pcie (wifi/3g/4g supported),

2*pci
bios
ami uefi bios
system
windows 7/8.1/10, linux
i/o interface
ethernet
2*intel® 1gbps pcie ethernet controller, rj45
serial
4*rs232, 1*rs232/485/422, 1*rs232/485
usb
6*usb 3.0, 7*usb 2.0
audio
realtek® alc662 5.1 channel hda codec, with mic/line-out/line-in
ps/2
1*ps/2 port (keyboard & mouse)
gpio
8*programmable gpio
feature interface
1*case open
display
display interface

1*dvi-d: max resolution up to 1920x1200@60hz

1*hdmi: max resolution up to 4096x2160@24hz

1*vga: max resolution up to 1920x1200@60hz

1*edp: max resolutionup to 1920x1200@60hz
multiple display
triple
mechanical & environment   
dimension
305*244mm
power input
atx 28p
temperature operation: 0℃~60℃, storage: -25℃~75℃
relative humidity
operation: 10%~90%, storage: 5%~95%, non-condensing
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