信步科技——国内领先的物联网智能硬件平台-云顶国际yd

sv6-b7526

intel 2/3代core i3/i5/i7处理器, b75芯片, 6*com, 10*usb, 2*lan,1*pcie x16, 1*pcie x4, 2*pci

支持intel 2/3代core i3/i5/i7处理器
采用intel b75芯片组
6*com, 10*usb, 2*intel千兆网口
1*vga, 1*hdmi, 1*lvds/edp, 支持双屏异显
1*pcie x16, 1*pcie x4, 2*pci
2*mini-pcie支持msata和wifi/3g/4g
支持vtm音频切换功能
规格
general
cpu
intel®  2nd and 3rd generation coretm i3/i5/i7, pentium®, celeron® cpu, lga1155
chipset
intel® b75 chipset, tdp 6.7w 
memory
ddr3-1066/1333/1600, 2*u-dimm, up to 16 gb 
storage
2*sata3.0, 3*sata 2.0 (sata0 supports sata dom)
expansion interface

1*pcie x16, 1*pcie x4, 2*pci,

2*mini-pcie (1*msata/usb2.0, 1*wifi/3g/4g supported)
bios
ami uefi bios
system
windows xp/7/8.1/10, linux
i/o interface
ethernet
2*intel® 1gbps pcie ethernet controller, rj45
serial
5*rs232, 1*rs232/ rs485/ rs422 (up to 10*rs232 with com extend chip)
usb
4*usb 3.0, 6*usb 2.0
audio
realtek® alc662 5.1 channel hda codec, with mic/line-out/line-in
ps/2
1*ps/2 port (keyboard & mouse)
parallel port
1*lpt header
gpio
8*programmable gpio
display
display interface

1*vga: max resolution up to 1920*1200@60hz

1*hdmi: max resolution up to 1920*1200@60hz

1*lvds/edp: lvds, dual channel 24 bit, max resolution up to 1920*1200@60hz

                    edp, max resolution up to 1920*1200@60hz
multiple display
triple
mechanical & environment   
dimension
244*244mm
power input
atx psu
temperature operation: 0℃~60℃, storage: -20℃~75℃
relative humidity
operation: 10%~90%, storage: 5%~95%, non-condensing
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